In the era of nanoscale manufacturing processes, the accuracy of gas detection directly determines product yield and production costs.
Semiconductor manufacturing has extremely high cleanliness requirements. ISO Class 1-5 cleanrooms require strict control of gaseous molecular contamination (AMC), as even a trace amount of contamination can lead to product defects.
The impurity content of high-purity gases used in processes such as CVD, etching, and ion implantation must be controlled at the ppb or even ppt level to ensure process stability and product yield.
Semiconductor production lines operate 24/7 without interruption, requiring real-time, continuous gas monitoring and zero-second response to promptly detect anomalies and ensure stable production.
Covering the entire wafer manufacturing process, ppb-level precision ensures process stability and product yield.
CVD化学气相沉积
Monitor the concentrations of precursor gases such as SiH₄, NH₃, N₂O, and TEOS to ensure the uniformity and quality of thin film deposition.
离子注入
Monitor the concentrations of doping gases such as BF₃, PH₃, and AsH₃ to ensure doping uniformity and precise control.
刻蚀工艺
Real-time monitoring of etching gases such as CF₄, SF₆, Cl₂, and BCl₃ allows for precise control of etching rate and selectivity.
光刻工艺
Monitor photoresist solvent vapors (PGMEA, EL, etc.) and developer vapors to ensure a safe process environment.
Process Coverage
Continuous monitoring
Abnormal alarm
Data Records
Types of gas detected
System reliability
24/7 operation
Maintenance downtime